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Precision Parts

Production Equipment

Government Solutions






IC Module Production

Mühlbauer is the only one-stop shop technology partner who can offer the complete manufacturing line for the production of IC modules. We offer high quality and high precision state-of-the-art equipment - ranging from die bonding, where the die is placed onto the backside of the module tape, to wire bonding, encapsulation, inspection and electric testing of the finished module tapes. Our market proven machine concept and continuous further development of hard- and software allows us to say that you are in good hands with one of the most competent suppliers of IC module production equipment. Using our vast experience we offer an optimal consulting solution from the planning of your production through to sales and after sales and bring you together with all primary global players on the IC module market - and that worldwide! Our flexible financing concepts provide an additional incentive for choosing Mühlbauer solutions.


Die Bonding

The chip is placed onto an IC module tape (lead frame). Typically, epoxy glues are used to fix the chip on the rear side of the tape. The exact pick-up and place position of the chip from the wafer is controlled by several vision systems. After chip attach the resin is cured by an inline thermal curing oven before the tape is finally rolled up.


Wire Bonding

The contact pads of the chip are electrically connected to the contact pads of the tape by an approximately 30μm thick gold wire. The wires are fixed to the contact pads using the thermosonic bonding method.



The resin is now dispensed in order to protect the chip and open wires against mechanical and environmental stress. Typically a transparent UV curing material or a black thermal curing material are used for encapsulation. Due to the high accuracy of this method, no additional surface treatment like milling is necessary. For the dispensing process itself, two different methodes can be used: Dam&Fill or Glob Top. In the Dam&Fill mode, the first dispensing head places a dam bar to limit the glob top area. Then, a second dispensing head fills the area inside the dam. In the Glob Top mode, both dispensing heads completely fill the whole module.


Tape Inspection

The fully automatic optical inspection carries out a thickness measurement and checks the glob tops and the surfaces. The front and/or rear side of the tape is controlled for surface defects like open wedges or scratches, fingerprints, etc. It is even possible to integrate an electrical test station to get completely finished modules ready for shipment. Faulty modules are clearly marked by a reject punch hole.



This process step is typically used for 3-row tapes for contactless cards, ID applications and ePassports. The multi plunger mold system works with an electro-mechanical press. The process includes off-line cleaning which increases the productive uptime.


Electrical Test & Pre-Personalization

As an output functional test, the IC modules are electrically singulated and tested or even pre-personalized in one process step. Depending on the chip type (memory or microprocessor chip) complex test routines and parameter tests are performed by best-in-class test readers. Faulty modules are clearly marked by a punch hole.